Intel Server System MCB2312WHY2

Intel Server System MCB2312WHY2

MPN MCB2312WHY2

Krājumi

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Con...

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    Specifikācijas MCB2312WHY2

    Design

    Chassis type

    Rack (2U)

    Optical drive type

    N

    Redundant fans support

    Yes

    Expansion slots

    PCI Express slots version

    3.0

    PCI Express x1 (Gen 2.x) slots

    1

    PCI Express x1 slots

    1

    PCI Express x4 (Gen 3.x) slots

    1

    PCI Express x4 slots

    1

    PCI Express x8 (Gen 3.x) slots

    7

    PCI Express x8 slots

    7

    Memory

    ECC

    Yes

    Internal memory

    16 GB

    Internal memory type

    DDR4-SDRAM

    Maximum internal memory

    1,5 TB

    Memory slots

    24

    Network

    Ethernet LAN

    Yes

    Other features

    Embedded USB (eUSB) SSD option

    Yes

    Form factor

    2U

    Heat sink

    2

    Hot-swap HDD bays

    Yes

    Integrated BMC with IPMI

    Yes

    Number of DIMM slots

    24

    Number of processors supported

    2

    Rack-Friendly board

    Yes

    Supported memory types

    DDR4-SDRAM

    Package dimensions

    Gross Weight (Package, kg)

    0,99 kg

    Packaging content

    Heat sink included

    Yes

    Performance

    Harmonized System (HS) code

    84714100

    Integrated BMC with IPMI

    Yes

    Intel Advanced Management Technology

    Yes

    Intel Build Assurance Technology

    Yes

    Intel Efficient Power Technology

    Yes

    Intel Quiet Thermal Technology

    Yes

    Intel Rapid Storage Technology enterprise

    Yes

    Intel Server Customization Technology

    Yes

    Rack-Friendly board

    Yes

    Trusted Platform Module (TPM)

    Yes

    Trusted Platform Module (TPM) version

    2.0

    Ports & interfaces

    Ethernet LAN (RJ-45) ports

    4

    InfiniBand

    No

    Total number of SATA connectors

    10

    Power

    Number of main power supplies

    2

    Number of power supply units

    2

    Power supply

    1100 Watt

    Power supply type

    AC

    Redundant power supply (RPS) support

    Yes

    Processor

    Bus type

    QPI

    Conflict-Free processor

    Yes

    ECC supported by processor

    Yes

    Embedded options available

    No

    Execute Disable Bit

    Yes

    Idle States

    Yes

    Intel Remote Management Module Support

    Y

    Maximum number of PCI Express lanes

    40

    Memory bandwidth supported by processor (max)

    76,8 GB/s

    Memory channels supported by processor

    Quad

    Memory clock speeds supported by processor

    1600, 1866, 2133, 2400

    Memory types supported by processor

    DDR4-SDRAM

    Motherboard chipset

    Intel® C612

    Number of processors installed

    2

    Number of QPI links

    2

    PCI Express configurations

    1x16, 1x4, 1x8

    Physical Address Extension (PAE)

    Yes

    Physical Address Extension (PAE)

    46 bit

    Processor boost frequency

    3,2 GHz

    Processor cache

    35 MB

    Processor cache type

    Smart Cache

    Processor code

    SR2N4

    Processor codename

    Broadwell

    Processor cores

    14

    Processor family

    Intel® Xeon® E5 v4

    Processor frequency

    2 GHz

    Processor lithography

    14 nm

    Processor manufacturer

    Intel

    Processor model

    E5-2660V4

    Processor operating modes

    64-bit

    Processor package size

    45 x 52.5 mm

    Processor series

    Intel Xeon E5-2600 v4

    Processor socket

    LGA 2011-v3

    Processor threads

    28

    Scalability

    2S

    Stepping

    M0

    Supported instruction sets

    AVX 2.0

    System bus rate

    9,6 Gigatransferi sekundē (GT/s)

    Tcase

    79 °C

    Thermal Design Power (TDP)

    105 Watt

    Thermal Monitoring Technologies

    Yes

    Processor special features

    Connector for Intel I/O Expansion Module x8 Gen 3

    1

    CPU configuration (max)

    2

    Enhanced Intel SpeedStep Technology

    Yes

    Intel 64

    Yes

    Intel Demand Based Switching

    Yes

    Intel Enhanced Halt State

    Yes

    Intel Fast Memory Access

    Yes

    Intel Flex Memory Access

    No

    Intel I/O Acceleration Technology

    Yes

    Intel Identity Protection Technology version

    0.00

    Intel On-Demand Power Redundancy Technology

    Yes

    Intel Rapid Storage Technology

    No

    Intel Remote Management Module Support

    Y

    Intel Secure Key Technology version

    1.00

    Intel Trusted Execution Technology

    Yes

    Intel TSX-NI

    Yes

    Intel TSX-NI version

    1.00

    Intel Virtualization Technology (VT-x)

    Yes

    Intel Virtualization Technology for Directed I/O (VT-d)

    Yes

    Intel VT-x with Extended Page Tables (EPT)

    Yes

    Intel® AES New Instructions (Intel® AES-NI)

    Yes

    Intel® Hyper Threading Technology (Intel® HT Technology)

    Yes

    Intel® Identity Protection Technology (Intel® IPT)

    No

    Intel® Matrix Storage Technology (Intel® MST)

    No

    Intel® OS Guard

    Yes

    Intel® Secure Key

    Yes

    Intel® Turbo Boost Technology

    2.0

    Intel® vPro™ Technology

    Yes

    Processor ARK ID

    91772

    Product dimensions

    Net Weight (Product, kg)

    0,89 kg

    Product Depth

    70,99 cm

    Product Height

    8,74 cm

    Product Width

    43 cm

    Storage

    Embedded USB (eUSB) SSD option

    Yes

    Number of HDDs supported

    16

    Number of SSDs installed

    5

    Optical drive type

    N

    RAID support

    Yes

    SSD capacity

    3,5 TB

    Supported HDD sizes

    2.5

    Total storage capacity

    3,5 TB

    Technical details

    Backplanes support

    Yes

    Expected discontinuance date

    Q1'18

    Extended warranty available for purchase (select countries)

    Yes

    Internal I/O Expansion Module x8 Gen 3

    1

    Launch date

    Q3'16

    Optical drive supported

    No

    Product type

    System

    Redundant fans

    Y

    Status

    Discontinued

    Target market

    Cloud/Datacenter

    USB ports quantity

    5

    Vendor information

    Brand Name

    Warranty

    1 Gads (-i)

    Apraksts

    Server System MCB2312WHY2

    The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

    IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

    Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

    Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

    Iemesli, kāpēc pirkt

    Conflict-Free processor

    Conflict-Free processor

    Does not contain "conflict minerals": tantalum, tin, tungsten, and gold.

    *Iepriekš minētos datus par produktu sniedz Icecat. EET nevar būt atbildīgs par kļūdām saistībā ar to.

    EET LatvijaBregnerødvej 133 D3460 BirkerødPVN nr. 35239480
    Latvija / Latvija