- Sākums
- Serveru, datoru un printeru daļas
- Šasijas komponentes
- Barošanas bloku korpusi
- HP BLC7000 CTO Generation 2 – 507019-B21-RFB
HP BLC7000 CTO Generation 2
HP BLC7000 CTO Generation 2
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MPN 507019-B21-RFB
EAN / UPC 5712505897843
Krājumi
The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.
The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is deli...
Specifikācijas 507019-B21-RFB
Package dimensions
Gross Weight (Package, kg)
7 kg
Product dimensions
Net Weight (Product, kg)
6,9 kg
Vendor information
Brand Name
Homepage
http://h18000.www1.hp.com/products/quickspecs/division/division.html#12922
Warranty
1 Gads (-i)
Apraksts
The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.
The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is delivered through a pooled-power backplane, and power input flexibility is provided with choices of single-phase, 3-Phase AC input, and -48V DC input.
*Iepriekš minētos datus par produktu sniedz Icecat. EET nevar būt atbildīgs par kļūdām saistībā ar to.