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- Kingston 2/32 Memory Module 32 Gb 2 X 16 Gb Ddr4 3200 Mhz – HX432C16FB4AK2/32
Kingston 2/32 Memory Module 32 Gb 2 X 16 Gb Ddr4 3200 Mhz
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PlayKingston 2/32 Memory Module 32 Gb 2 X 16 Gb Ddr4 3200 Mhz
MPN HX432C16FB4AK2/32
Artikelnr. W128266238
Lagernivå
HyperX HX432C16FB4AK2/32 is a kit of two 2G x 64-bit (16GB) DDR4-3200 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 2G x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Total kit capacity is 32GB. Each module has been tested to run at DDR4-3200 at a low latency timing of 16-20-20 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact finge...
Läs hela beskrivningenOn-Die termination (ODT)
16 internal banks; 4 groups of 4 banks each
Bi-Directional Differential Data Strobe
8 bit pre-fetch
Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
Specifikationer för HX432C16FB4AK2/32
Features
Backlight
Yes
Backlight colour
Red/Green/Blue
CAS latency
16
Component for
PC/Server
Cooling type
Heatsink
Intel Extreme Memory Profile (XMP)
Yes
Intel Extreme Memory Profile (XMP) version
2.0
Internal memory
32 GB
Internal memory type
DDR4
JEDEC standard
Yes
Lead plating
Gold
Memory clock speed
3200 MHz
Memory form factor
288-pin DIMM
Memory layout (modules x size)
2 x 16 GB
Memory voltage
1.35
Module configuration
2048M x 64
Programming power voltage (VPP)
2,5 V
Refresh row cycle time
350 Nanosecond
Row active time
32 Nanosecond
Row cycle time
45,75 Nanosecond
Operational conditions
Operating temperature (T-T)
0 - 70 °C
Storage temperature (T-T)
-40 - 85 °C
Package dimensions
Gross Weight (Package, kg)
0,13 kg
Product dimensions
Net Weight (Product, kg)
0,1 kg
Product Depth
0,7 cm
Product Height
4,12 cm
Product Width
13,33 cm
Vendor information
Brand Name
Warranty
1 År
Beskrivning
HyperX HX432C16FB4AK2/32 is a kit of two 2G x 64-bit (16GB) DDR4-3200 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 2G x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Total kit capacity is 32GB. Each module has been tested to run at DDR4-3200 at a low latency timing of 16-20-20 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
Dokument
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