IBM IBM MEMORY 1GB PC2-3200 (2X512MB) ECC DDR2 SDRAM DIMM KIT

IBM IBM MEMORY 1GB PC2-3200 (2X512MB) ECC DDR2 SDRAM DIMM KIT

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MPN 73P3525-RFB

EAN/UPC 5705965872956

OEM 73P3525R

Starea stocului

This new dual-channel DDR2 memory option unleashes the power of the Intel Processor with its 800MHz front-side bus speed by matching the processor front-side bus bandwidth of 6.4GB with an equal, balanced 6.4GB of memory bandwidth. In combination with the CPU and chipset, system memory is one of the key contributors to overall system performance. This new memory offering is also known as DDR400 memory and it is the highest performing memory architecture available in the Intel server/workstation ...

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    Specificații pentru 73P3525-RFB

    Features

    CAS latency

    3

    ECC

    Y/Yes

    Internal memory

    1 Giga Bites

    Internal memory type

    DDR2

    Lead plating

    Gold

    Memory clock speed

    400 MHz

    Memory form factor

    240-pin DIMM

    Package dimensions

    Gross Weight (Package, kg)

    0,3 kg

    Product dimensions

    Net Weight (Product, kg)

    0,2 kg

    Vendor information

    Brand Name

    Warranty

    1 An(i)

    Descriere

    IBM MEMORY 1GB PC2-3200 (2X512MB) ECC DDR2 SDRAM DIMM KIT

    This new dual-channel DDR2 memory option unleashes the power of the Intel Processor with its 800MHz front-side bus speed by matching the processor front-side bus bandwidth of 6.4GB with an equal, balanced 6.4GB of memory bandwidth. In combination with the CPU and chipset, system memory is one of the key contributors to overall system performance. This new memory offering is also known as DDR400 memory and it is the highest performing memory architecture available in the Intel server/workstation market. One of the key features of this new memory advance is the FBGA (Fine Pitch Ball Grid Array) packaging technology which allows for a slim module design, therefore, increasing the air flow space between the memory module and the circuit board. This increased air flow equates to improved system thermal performance and reliability. These technology advances result in a balanced xSeries system/IntelliStation workstation platform which is optimized for memory demanding applications, such as MCAD, Electronic Design Automation, Digital Content Creation and Life Sciences.

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