HP BLC7000 CTO Generation 2

HP BLC7000 CTO Generation 2

Această piesă este folosită sau recondiționată. Este posibil ca toate accesoriile să NU fie incluse.

MPN 507019-B21-RFB

EAN/UPC 5712505897843

Starea stocului

The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.

The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is deli...

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    Specificații pentru 507019-B21-RFB

    Package dimensions

    Gross Weight (Package, kg)

    7 kg

    Product dimensions

    Net Weight (Product, kg)

    6,9 kg

    Vendor information

    Brand Name

    Homepage

    http://h18000.www1.hp.com/products/quickspecs/division/division.html#12922

    Warranty

    1 An(i)

    Descriere

    The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.

    The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is delivered through a pooled-power backplane, and power input flexibility is provided with choices of single-phase, 3-Phase AC input, and -48V DC input.

    *Datele despre produsul de mai sus sunt furnizate de Icecat. EET nu poate fi făcut responsabil pentru erori în legătură cu aceasta.

    EET RomâniaBregnerød vej 133 D3460 BirkerødNr. TVA 35239480
    România / Română