- Pagrindinis puslapis
- Serverių, kompiuterių ir spausdintuvų dalys
- Serveriai ir kompiuteriai
- Sistemos komponentai
- CPU
- HP Opteron 6212 8c proc kit – 655089-B21-RFB
HP Opteron 6212 8c proc kit
HP Opteron 6212 8c proc kit
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MPN 655089-B21-RFB
Atsargų lygis
AMD proudly presents the AMD Opteron™ 6200 Series—the world’s first and only 16-core x86 server processor with the highest core density for incredible scalability to handle demanding multi-threaded workloads such as cloud computing, virtualization, high-performance computing (HPC), databases and business applications.
The innovative modular architecture helps pack in more cores, making it the natural choice for heavy-threaded cloud computing environments and enterprise applications that deman...
Specifikacijos 655089-B21-RFB
Features
Market segment
Server
Graphics
On-board graphics card
No
Memory
Memory clock speeds supported by processor
2000
Operational conditions
Maximum operating temperature
71,7 °C
Other features
L1 cache
0,04688 MB
On-board memory controller
Yes
Temperature (max)
71,7 °C
Package dimensions
Gross Weight (Package, kg)
1,4 kg
Processor
Box
No
Component for
Server/workstation
L2 cache speed
2600 GHz
Processor base frequency
2,6 GHz
Processor cache
16 MB
Processor cache type
L3
Processor cores
8
Processor family
AMD Opteron
Processor lithography
32 nm
Processor model
6212
Processor operating modes
64-bit
Processor socket
Socket G34
Stepping
B2
System bus rate
6400 GT/s
Thermal Design Power (TDP)
115 Watt
Processor special features
AMD Virtualization Technology
Yes
Product dimensions
Net Weight (Product, kg)
1,2999999999999998 kg
Vendor information
Brand Name
Warranty
1 Metai
Aprašymas
AMD proudly presents the AMD Opteron™ 6200 Series—the world’s first and only 16-core x86 server processor with the highest core density for incredible scalability to handle demanding multi-threaded workloads such as cloud computing, virtualization, high-performance computing (HPC), databases and business applications.
The innovative modular architecture helps pack in more cores, making it the natural choice for heavy-threaded cloud computing environments and enterprise applications that demand outstanding performance and scalability.
Performance
AMD has designed several new features, including AMD Turbo CORE technology and Flex FP, into its processors so that datacenters can maximize their performance potential.
AMD-P
New additions to the AMD-P suite of energy-efficient technologies like TDP Power Cap and the C6 power state helps customers maximize the performance per watt in their datacenter and can help lower power and cooling costs.
Direct Connect Architecture 2.0
HyperTransport™ 3.0 Technology (HT3) enables outstanding interconnect speeds between cores, cache and quad-memory channels supporting up to 1600MHz DDR3 memory.
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