MPN MK-923
Réf. W126826025
EAN / UPC 837324004519
Niveau de stock
This aluminium heatsink sits in direct contact with the Raspberry Pi compute module’s integrated processing chip (SoC). The surface area of the
heatsink is maximised to most efficiently utilise thermal conduction and draw heat away from the
processor. Used by Brainboxes in the BB-400 andBB-411.
1 cm
0,123 kg
11,5 cm
12 cm
0,023 kg
This aluminium heatsink sits in direct contact with the Raspberry Pi compute module’s integrated processing chip (SoC). The surface area of the
heatsink is maximised to most efficiently utilise thermal conduction and draw heat away from the
processor. Used by Brainboxes in the BB-400 andBB-411.
*Les données produit ci-dessus sont fournies par Icecat. A cet égard, EET ne peut être tenu responsable des erreurs.