MPN AIR-AP3702I-UXK9
EAN / UPC 882658728907
Niveau de stock
With the industry’s only enterprise class 4x4 MIMO, three-spatial-stream access points that support the IEEE’s new 802.11ac specification, the Cisco® Aironet® 3700 Series delivers industry-leading performance and a High Density Experience (HD Experience) for both the enterprise and service provider markets. The Aironet 3700 Series extends support to a new generation of Wi-Fi clients, such as smartphones, tablets, and high-performance laptops that have integrated 802.11ac support.
In its...
Oui
Oui
80 MHz
1300 Mbit/s
10/100/1000 Mbit/s
23 dBmW
21 canaux
IEEE 802.11a/IEEE 802.11ac/IEEE 802.11g/IEEE 802.11n
1300 Mbit/s
0 - 3000 m
0 - 4572 m
10 - 90 %
0 - 40 °C
-30 - 70 °C
Oui
2
Blanc
Non
Mur/Plafond
1,68 kg
5,4 cm
1,5799999999999998 kg
22,1 cm
22,1 cm
50 - 60 Hz
50 - 60 Hz
100 - 240 V
100 - 240 V
64 Mo
512 Mo
802.1x RADIUS/AES/EAP-FAST/EAP-PEAP/EAP-SIM/EAP-TLS/EAP-TTLS/MSCHAPv2/PEAP/TKIP
3 Month(s)
With the industry’s only enterprise class 4x4 MIMO, three-spatial-stream access points that support the IEEE’s new 802.11ac specification, the Cisco® Aironet® 3700 Series delivers industry-leading performance and a High Density Experience (HD Experience) for both the enterprise and service provider markets. The Aironet 3700 Series extends support to a new generation of Wi-Fi clients, such as smartphones, tablets, and high-performance laptops that have integrated 802.11ac support.
In its first implementation, 802.11ac wave 1 provides a rate of up to 1.3 Gbps, roughly triple the rates offered by today’s high-end 802.11n access points. This provides the necessary foundation for enterprise and service provider networks alike to stay ahead of the performance and bandwidth expectations and needs of their wireless users.
Due to its convenience, wireless access is increasingly the preferred form of network connectivity for corporate users. Along with this shift, there is an expectation that wireless should not slow down user’s day-to-day work, but should enable a high-performance experience while allowing users to move freely around the corporate environment.
By Utilizing a Purpose-built Innovative Chipset with the Best-in-class RF Architecture for a High Density Experience (HD Experience).
*Les données produit ci-dessus sont fournies par Icecat. A cet égard, EET ne peut être tenu responsable des erreurs.