MPN MK-923
Artikel-Nr. W126826025
EAN / UPC 837324004519
Lagerbestand
This aluminium heatsink sits in direct contact with the Raspberry Pi compute module’s integrated processing chip (SoC). The surface area of the
heatsink is maximised to most efficiently utilise thermal conduction and draw heat away from the
processor. Used by Brainboxes in the BB-400 andBB-411.
1 cm
0,123 kg
11,5 cm
12 cm
0,023 kg
This aluminium heatsink sits in direct contact with the Raspberry Pi compute module’s integrated processing chip (SoC). The surface area of the
heatsink is maximised to most efficiently utilise thermal conduction and draw heat away from the
processor. Used by Brainboxes in the BB-400 andBB-411.
*Die oben genannten Produktdaten werden von Icecat zur Verfügung gestellt. EET ist nicht verantwortlich für eventuelle Fehler in diesem Zusammenhang.