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- Acer Intel Core i3-2370M Processor (3M Cache, 2.40 GHz) – KC.23701.DMP
Acer Intel Core i3-2370M Processor (3M Cache, 2.40 GHz)
Acer Intel Core i3-2370M Processor (3M Cache, 2.40 GHz)
MPN KC.23701.DMP
Lager
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX ...
Kompatibel med
Acer
Aspire
TravelMate
Specifikationer for KC.23701.DMP
Features
CPU configuration (max)
1
Execute Disable Bit
Yes
Graphics & IMC lithography
32 nm
Idle States
Yes
Market segment
Mobile
Maximum number of PCI Express lanes
16
PCI Express configurations
1x16/1x8+2x4/2x8
PCI Express slots version
2.0
Supported instruction sets
AVX
Thermal Monitoring Technologies
Yes
Graphics
Number of displays supported (on-board graphics)
2
On-board graphics card
Yes
On-board graphics card base frequency
650 MHz
On-board graphics card dynamic frequency (max)
1150 MHz
On-board graphics card model
Intel® HD Graphics 3000
Memory
ECC
No
Maximum internal memory supported by processor
16 GB
Memory channels
Dual-channel
Memory clock speeds supported by processor
1066/1333 MHz
Memory types supported by processor
DDR3-SDRAM
Operational conditions
Tjunction
85 °C
Other features
Intel® Virtualization Technology (Intel® VT)
VT-x
Package dimensions
Gross Weight (Package, kg)
0,05 kg
Power
Thermal Design Power (TDP)
35 Watt
Processor
Box
No
Bus type
DMI
Component for
Laptop
L3 cache speed
2,4 GHz
Memory bandwidth supported by processor (max)
21,3 GB/s
Processor base frequency
2,4 GHz
Processor cache
3 MB
Processor cache type
L3
Processor code
SR0DP
Processor cores
2
Processor family
Intel® Core™ i3
Processor frequency
2,4 GHz
Processor generation
2nd gen Intel® Core™ i3
Processor lithography
32 nm
Processor model
i3-2370M
Processor operating modes
64-bit
Processor socket
PGA988
Processor threads
4
Stepping
J1
System bus rate
5 GT/s
Thermal Design Power (TDP)
35 Watt
Processor special features
Enhanced Intel SpeedStep Technology
Yes
Intel Fast Memory Access
Yes
Intel FDI Technology
Yes
Intel Flex Memory Access
Yes
Intel Virtualization Technology (VT-x)
Yes
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel® Anti-Theft Technology (Intel® AT)
Yes
Intel® Clear Video HD Technology (Intel® CVT HD)
Yes
Intel® Hyper Threading Technology (Intel® HT Technology)
Yes
Intel® Identity Protection Technology (Intel® IPT)
Yes
Intel® InTru™ 3D Technology
Yes
Intel® My WiFi Technology (Intel® MWT)
Yes
Intel® Quick Sync Video Technology
Yes
Intel® Smart Cache
Yes
Intel® Wireless Display (Intel® WiDi)
Yes
Product dimensions
Net Weight (Product, kg)
0,04 kg
Vendor information
Brand Name
Warranty
3 Month(s)
Weight & dimensions
Processor package size
37,5 cm
Beskrivelse
Intel Core i3-2370M Processor (3M Cache, 2.40 GHz)
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
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