Hewlett Packard Enterprise HP DL165 G7 AMD Opteron™ 6274 (2.20GHz/16-core/16MB/115W) FIO Processor Kit

Hewlett Packard Enterprise HP DL165 G7 AMD Opteron™ 6274 (2.20GHz/16-core/16MB/115W) FIO Processor Kit

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MPN 663373-L21-RFB

EAN/UPC 5712505848180

OEM 663373-L21

Lager

AMD proudly presents the new AMD Opteron 6200 Series-the world's first and only 16-core x86 server processor with the highest core density for incredible scalability to handle demanding multi-threaded workloads such as cloud computing, virtualization, high-performance computing (HPC), databases and business applications.

The innovative modular architecture helps pack in more cores, making it the natural choice for heavy-threaded cloud computing environments and enterprise applications t...

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    Specifikationer for 663373-L21-RFB

    Features

    Market segment

    Desktop

    Other features

    L1 cache

    0,75 MB

    Temperature (max)

    69 °C

    Package dimensions

    Gross Weight (Package, kg)

    1 kg

    Power

    Thermal Design Power (TDP)

    115 Watt

    Processor

    Component for

    PC

    Processor base frequency

    2,2 GHz

    Processor cache

    16 MB

    Processor cache type

    L3

    Processor cores

    16

    Processor family

    AMD Opteron

    Processor frequency

    2,2 GHz

    Processor lithography

    32 nm

    Processor model

    6274

    Processor operating modes

    64-bit

    Processor socket

    Socket G34

    Thermal Design Power (TDP)

    115 Watt

    Processor special features

    AMD HyperTransport Technology

    Yes

    AMD Virtualization Technology

    Yes

    Product dimensions

    Net Weight (Product, kg)

    0,9 kg

    Vendor information

    Warranty

    1 År

    Beskrivelse

    HP DL165 G7 AMD Opteron™ 6274 (2.20GHz/16-core/16MB/115W) FIO Processor Kit

    AMD proudly presents the new AMD Opteron 6200 Series-the world's first and only 16-core x86 server processor with the highest core density for incredible scalability to handle demanding multi-threaded workloads such as cloud computing, virtualization, high-performance computing (HPC), databases and business applications.

    The innovative modular architecture helps pack in more cores, making it the natural choice for heavy-threaded cloud computing environments and enterprise applications that demand outstanding performance and scalability

    *Produktdata ovenfor leveres af Icecat. EET kan ikke holdes ansvarlig for fejl i forbindelse hertil.

    EET Danmark A/SBregnerødvej 133 D3460 BirkerødCVR nr. 33946201
    Danmark / Dansk