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- Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g – XZ019
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
MPN XZ019
produktové číslo W128598375
Úroveň zásob
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
Specifikace pro XZ019
Features
Certification
CE
Operating temperature (T-T)
-30 - 280 °C
Product colour
Black/Red/White
Thermal conductivity
5,15 W/m·K
Thermal resistance
0,201 °C/W
Viscosity note
73 CPS
Package dimensions
Depth (package,cm)
2 cm
Gross Weight (Package, kg)
0,01 kg
Height (package,cm)
1 cm
Width (package,cm)
12 cm
Packaging data
Quantity per pack
1 kusů
Product dimensions
Net Weight (Product, kg)
0,01 kg
Technical details
Sustainability certificates
RoHS
Vendor information
Brand Name
Warranty
1 Rok (y)
Popis
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
*Výše uvedené údaje o produktu poskytuje společnost Icecat. EET nenese odpovědnost za chyby v této souvislosti.