MPN 354566-B21-RFB
EAN/UPC 5711783533825
OEM 354566-B21
Nível de stock
Ultra-dense server blades optimised for rapid deployment and provisioning; Ideal for space-constrained enterprises and service providers
The HP ProLiant BL30p delivers the ideal mix of performance, density and manageability.
Delivers performance, density and manageability.
Optimized for maximum density deployments, the HP ProLiant BL30p delivers the ideal mix of performance, density and manageability.
It uses the BL p-Class infrastructure components (centralized power...
ProLiant BL
1 kg
0,9 kg
1 Ano(s)
Ultra-dense server blades optimised for rapid deployment and provisioning; Ideal for space-constrained enterprises and service providers
The HP ProLiant BL30p delivers the ideal mix of performance, density and manageability.
Delivers performance, density and manageability.
Optimized for maximum density deployments, the HP ProLiant BL30p delivers the ideal mix of performance, density and manageability.
It uses the BL p-Class infrastructure components (centralized power sub-system, interconnect switches, patch panels).
The HP ProLiant BL30p is optimized for maximum density deployments of high performance 32 bit systems. Providing up to 192 of Intels latest Xeon DP processors in a standard rack, it delivers the ideal mix of performance, density and manageability for modular high performance computing.
It is the latest addition to the BL p-Class server blade line and utilizes the BL p-Class infrastructure components such as the centralized power sub-system, interconnect switches and patch panels.
The HP ProLiant BL30p is optimized for maximum density deployments of high performance 32 bit systems. Providing up to 192 of Intels latest Xeon DP processors in a standard rack, the ProLiant BL30p delivers the ideal mix of performance, density and manageability for modular high performance computing.
The ProLiant BL30p is the latest addition to the BL p-Class server blade line and utilizes the BL p-Class infrastructure components such as the centralized power sub-system, interconnect switches and patch panels.
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