IBM 2 X 1GB PC2-3200 ECC DDR2 SDRAM RDIMM KIT NS (NMS)

IBM 2 X 1GB PC2-3200 ECC DDR2 SDRAM RDIMM KIT NS (NMS)

Ce produit est reconditionné. Les accessoires peuvent NE PAS être inclus.

MPN 73P2866-RFB

EAN / UPC 5704327537137

OEM 73P2866R 39M5808 39M5809

Niveau de stock

This new dual-channel DDR2 (DDR400) memory option unleashes the power of the Intel Processor with its 800MHz front-side bus speed by matching the processor front-side bus bandwidth with an equal and balanced 6.4GB of memory bandwidth. This new higher peak bandwidth / transfer rate delivers up to 20% higher performance than the previous DDR memory offerings. DDR400 memory is the highest performing memory architectures available in the Intel server market today. One of the key features of this new...

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    Alternatives exactes
    IBM XSERIES 2GB 2x1GB PC2-3200 KIT
    IBM XSERIES 2GB 2x1GB PC2-3200 KIT
    MPN
    39M5809-RFB

    Conditions

    Reconditionné
    CoreParts 2Gb kit DDR2 400MHz ECC/REG DIMM

    Caractéristiques 73P2866-RFB

    Caractéristiques

    ECC

    Oui

    Fréquence de la mémoire

    400 MHz

    Latence CAS

    3

    Mémoire interne

    2 Go

    Placage en plomb

    Or

    Support de mémoire

    240-pin DIMM

    Type de mémoire interne

    DDR2

    Package dimensions

    Depth (package,cm)

    1 cm

    Gross Weight (Package, kg)

    0,04 kg

    Height (package,cm)

    3 cm

    Width (package,cm)

    13,5 cm

    Product dimensions

    Net Weight (Product, kg)

    0,03 kg

    Vendor information

    Brand Name

    Warranty

    1 Année (s)

    Description

    2 X 1GB PC2-3200 ECC DDR2 SDRAM RDIMM KIT NS (NMS)

    This new dual-channel DDR2 (DDR400) memory option unleashes the power of the Intel Processor with its 800MHz front-side bus speed by matching the processor front-side bus bandwidth with an equal and balanced 6.4GB of memory bandwidth. This new higher peak bandwidth / transfer rate delivers up to 20% higher performance than the previous DDR memory offerings. DDR400 memory is the highest performing memory architectures available in the Intel server market today. One of the key features of this new memory advance is the FBGA (Fine Pitch Ball Grid Array) packaging technology which allows for a slim module design that increases the air flow space between the memory module and the circuit board. This increased air flow equates to improved system thermal performance and overall system reliability.

    Features & Benefits:

    • Higher peak bandwidth/transfer rates for increased performance delivers up to 20% higher peak bandwidth than DDR memory
    • Memory Expansion to 8GBs for xSeries x226, Z20 and Blade servers
    • Lower power consumption and better thermal characteristics are ideal for Blade servers delivering a 50% power reduction when compared to DDR memory
    • Up to four DIMMs per channel compared to three DIMMs with DDR, resulting in as much as a 25% improvement compared to DDR memory.

    *Les données produit ci-dessus sont fournies par Icecat. A cet égard, EET ne peut être tenu responsable des erreurs.

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