Hewlett Packard Enterprise Intel® Xeon® Processor E5430 (12M Cache, 2.66 GHz, 1333 MHz FSB)

Hewlett Packard Enterprise Intel® Xeon® Processor E5430 (12M Cache, 2.66 GHz, 1333 MHz FSB)

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MPN 457935-B21-RFB

EAN / UPC 883585408948

OEM 457935-B21R

Performance. Efficiency. Agility.
Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing.

The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset ...

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    Especificaciones

    Features

    Embedded options available

    N

    Execute Disable Bit

    Y

    Idle States

    Y

    Market segment

    Server

    Number of Processing Die Transistors

    820 M

    Processing Die size

    214 mm²

    Thermal Monitoring Technologies

    Y

    Graphics

    On-board graphics card

    N

    Operational conditions

    Tcase

    67 °C

    Other features

    Intel® Virtualization Technology (Intel® VT)

    VT-x

    Package dimensions

    Gross Weight (Package, kg)

    0,75 kg

    Power

    Thermal Design Power (TDP)

    80 Watt

    VID Voltage Range

    0.85 - 1.35 V

    Processor

    Box

    N

    Compatible chipsets

    Intel® 5000P, Intel® 5000V, Intel® 5000X, Intel® 5100, Intel® 5400

    Component for

    Server/workstation

    CPU multiplier (bus/core ratio)

    8

    FSB Parity

    Y

    L2 cache speed

    2,66 GHz

    Processor base frequency

    2,66 GHz

    Processor cache

    12 MB

    Processor cache type

    L2

    Processor cores

    4

    Processor family

    Intel® Xeon® 5000 Sequence

    Processor frequency

    2,66 GHz

    Processor front side bus

    1333 MHz

    Processor lithography

    45 nm

    Processor model

    E5430

    Processor operating modes

    64-bit

    Processor socket

    LGA 771 (Socket J)

    Processor system type

    DP

    Processor threads

    4

    Stepping

    E0

    Thermal Design Power (TDP)

    80 Watt

    VID Voltage Range

    0.85 - 1.35 V

    Processor special features

    Enhanced Intel SpeedStep Technology

    Y

    Intel Demand Based Switching

    Y

    Intel Virtualization Technology (VT-x)

    Y

    Intel VT-x with Extended Page Tables (EPT)

    Y

    Product dimensions

    Net Weight (Product, kg)

    0,65 kg

    Vendor information

    Homepage

    http://welcome.hp.com/country/us/en/prodserv/printer-computer-accessories.html

    Warranty

    1 Año/s

    Weight & dimensions

    Processor package size

    37,5 cm

    Descripción

    Intel® Xeon® Processor E5430 (12M Cache, 2.66 GHz, 1333 MHz FSB)

    Performance. Efficiency. Agility.
    Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing.

    The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel® Xeon® processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors.

    The Dual-Core Intel Xeon processor 5100 series is compatible with Intel® 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express* and the option of Intel I/O Acceleration Technology.

    Dual-core processing
    Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.

    Intel® Core™ microarchitecture
    Better performance on multiple application types and user environments at a substantially reduce power envelope.

    Majority of SKUs at 65W
    Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.

    Ultra-dense, ultra low-power SKUs at 40W
    Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.

    4 MB shared L2 cache
    Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
    Entire L2 cache can be allocated to one core.

    1066 and 1333 MHz system bus
    Faster system bus speeds than previous generations for increased throughput.

    Intel® Virtualization Technology
    New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.

    Intel® Extended Memory 64 Technology (Intel® EM64T)
    Flexibility for 64-bit and 32-bit applications and operating systems.

    Enhanced Intel® Speedstep™ Technology
    Helps reduce average system power consumption and potentially improves system acoustics.

    *Los datos de producto anteriores son proporcionados por Icecat. EET no se hace responsable de los errores en relación con esto.