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- Hewlett Packard Enterprise HP DL585 G7 AMD Opteron 6276 (2.30GHz/16-core/16MB/115W) FIO 2-processor Kit – 653978-L21-RFB
Hewlett Packard Enterprise HP DL585 G7 AMD Opteron 6276 (2.30GHz/16-core/16MB/115W) FIO 2-processor Kit
Hewlett Packard Enterprise HP DL585 G7 AMD Opteron 6276 (2.30GHz/16-core/16MB/115W) FIO 2-processor Kit
This part is used or refurbished. All accessories may NOT be included.
MPN 653978-L21-RFB
EAN/UPC 5711783570202
Stock level
AMD proudly presents the new AMD Opteron 6200 Series-the world's first and only 16-core x86 server processor with the highest core density for incredible scalability to handle demanding multi-threaded workloads such as cloud computing, virtualization, high-performance computing (HPC), databases and business applications.
The innovative modular architecture helps pack in more cores, making it the natural choice for heavy-threaded cloud computing environments and enterprise applications t...
Specifications for 653978-L21-RFB
Features
Market segment
Desktop
Other features
L1 cache
0.75 MB
Temperature (max)
69 °C
Package dimensions
Gross Weight (Package, kg)
1.2 kg
Power
Thermal Design Power (TDP)
115 Watt
Processor
Component for
PC
Processor base frequency
2.3 GHz
Processor cache
16 MB
Processor cache type
L3
Processor cores
16
Processor family
AMD Opteron
Processor frequency
2.3 GHz
Processor lithography
32 nm
Processor model
6276
Processor operating modes
64-bit
Processor socket
Socket G34
System bus rate
6.4 GT/s
Thermal Design Power (TDP)
115 Watt
Processor special features
AMD HyperTransport Technology
Yes
AMD Virtualization Technology
Yes
Product dimensions
Net Weight (Product, kg)
1 kg
Vendor information
Brand Name
Warranty
1 Year(s)
Description
HP DL585 G7 AMD Opteron 6276 (2.30GHz/16-core/16MB/115W) FIO 2-processor Kit
AMD proudly presents the new AMD Opteron 6200 Series-the world's first and only 16-core x86 server processor with the highest core density for incredible scalability to handle demanding multi-threaded workloads such as cloud computing, virtualization, high-performance computing (HPC), databases and business applications.
The innovative modular architecture helps pack in more cores, making it the natural choice for heavy-threaded cloud computing environments and enterprise applications that demand outstanding performance and scalability.
*The product data above is provided by Icecat. EET cannot be held responsible for errors in relation to this.