MPN 507019-B21-RFB
EAN/UPC 5712505897843
Stock level
The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.
The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is deli...
7 kg
6.9 kg
http://h18000.www1.hp.com/products/quickspecs/division/division.html#12922
1 Year(s)
The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.
The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is delivered through a pooled-power backplane, and power input flexibility is provided with choices of single-phase, 3-Phase AC input, and -48V DC input.
*The product data above is provided by Icecat. EET cannot be held responsible for errors in relation to this.