HP BLC7000 CTO Generation 2

HP BLC7000 CTO Generation 2

This part is used or refurbished. All accessories may NOT be included.

MPN 507019-B21-RFB

EAN/UPC 5712505897843

Stock level

The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.

The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is deli...

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    Specifications for 507019-B21-RFB

    Package dimensions

    Gross Weight (Package, kg)

    7 kg

    Product dimensions

    Net Weight (Product, kg)

    6.9 kg

    Vendor information

    Brand Name

    Homepage

    http://h18000.www1.hp.com/products/quickspecs/division/division.html#12922

    Warranty

    1 Year(s)

    Description

    The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.

    The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is delivered through a pooled-power backplane, and power input flexibility is provided with choices of single-phase, 3-Phase AC input, and -48V DC input.

    *The product data above is provided by Icecat. EET cannot be held responsible for errors in relation to this.

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