Hewlett Packard Enterprise Screw down type heatsink assembly

Hewlett Packard Enterprise Screw down type heatsink assembly

This part is used or refurbished. All accessories may NOT be included.

MPN 519326-001-RFB

EAN/UPC 5706998857163

Stock level

Screws to studs on the optional second processor board.

    Compatible with

    Specifications for 519326-001-RFB

    Package dimensions

    Gross Weight (Package, kg)

    0.1 kg

    Performance

    Compatible processor series

    Intel® Xeon®

    Compatible products

    ProLiant ML330 G6

    Suitable for

    Processor

    Suitable location

    Processor

    Supported processor sockets

    LGA 1366 (Socket B)

    Type

    Heatsink/Radiatior

    Product dimensions

    Net Weight (Product, kg)

    0.09 kg

    Vendor information

    Warranty

    1 Year(s)

    Description

    Screw down type heatsink assembly

    Screws to studs on the optional second processor board.

    *The product data above is provided by Icecat. EET cannot be held responsible for errors in relation to this.

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