IBM 2 X 1GB PC2-3200 ECC DDR2 SDRAM RDIMM KIT NS (NMS)

IBM 2 X 1GB PC2-3200 ECC DDR2 SDRAM RDIMM KIT NS (NMS)

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MPN 73P2866-RFB

EAN / UPC 5704327537137

OEM 73P2866R 39M5808 39M5809

Lagerbestand

This new dual-channel DDR2 (DDR400) memory option unleashes the power of the Intel Processor with its 800MHz front-side bus speed by matching the processor front-side bus bandwidth with an equal and balanced 6.4GB of memory bandwidth. This new higher peak bandwidth / transfer rate delivers up to 20% higher performance than the previous DDR memory offerings. DDR400 memory is the highest performing memory architectures available in the Intel server market today. One of the key features of this new...

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    MPN
    39M5809-RFB

    Bedingung

    Wiederaufbereitet
    CoreParts 2GB Memory Module for HP 400Mhz DDR2 Major DIMM - KIT 2x2GB

    Spezifikationen für 73P2866-RFB

    Features

    Bleiplattierung

    Gold

    CAS-Latenz

    3

    ECC

    Yes

    Interner Speicher

    2 GB

    Interner Speichertyp

    DDR2

    Speicherformfaktor

    240-pin DIMM

    Speichertaktfrequenz

    400 MHz

    Package dimensions

    Depth (package,cm)

    1 cm

    Gross Weight

    0,04 kg

    Height (package,cm)

    3 cm

    Width (package,cm)

    13,5 cm

    Product dimensions

    Net Weight

    0,03 kg

    Vendor information

    Brand Name

    Warranty

    1 Jahre)

    Beschreibung

    2 X 1GB PC2-3200 ECC DDR2 SDRAM RDIMM KIT NS (NMS)

    This new dual-channel DDR2 (DDR400) memory option unleashes the power of the Intel Processor with its 800MHz front-side bus speed by matching the processor front-side bus bandwidth with an equal and balanced 6.4GB of memory bandwidth. This new higher peak bandwidth / transfer rate delivers up to 20% higher performance than the previous DDR memory offerings. DDR400 memory is the highest performing memory architectures available in the Intel server market today. One of the key features of this new memory advance is the FBGA (Fine Pitch Ball Grid Array) packaging technology which allows for a slim module design that increases the air flow space between the memory module and the circuit board. This increased air flow equates to improved system thermal performance and overall system reliability.

    Features & Benefits:

    • Higher peak bandwidth/transfer rates for increased performance delivers up to 20% higher peak bandwidth than DDR memory
    • Memory Expansion to 8GBs for xSeries x226, Z20 and Blade servers
    • Lower power consumption and better thermal characteristics are ideal for Blade servers delivering a 50% power reduction when compared to DDR memory
    • Up to four DIMMs per channel compared to three DIMMs with DDR, resulting in as much as a 25% improvement compared to DDR memory.

    *Die oben genannten Produktdaten werden von Icecat zur Verfügung gestellt. EET ist nicht verantwortlich für eventuelle Fehler in diesem Zusammenhang.

    EET Deutschland GmbHElisabeth-Selbert-Straße 5a40764 LangenfeldMwSt.-Nummer DE814997043
    Deutschland / Deutsch