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  • Transcend Transcend DDR3, 1600 MHz, 2GB, SO-DIMM, 1Rx8, (512Mx8)x8, 1.5V – TS512MSK64V6H

Transcend Transcend DDR3, 1600 MHz, 2GB, SO-DIMM, 1Rx8, (512Mx8)x8, 1.5V

Transcend Transcend DDR3, 1600 MHz, 2GB, SO-DIMM, 1Rx8, (512Mx8)x8, 1.5V

MPN TS512MSK64V6H

EAN / UPC 760557825586

Lagerbestand

Transcend's DDR3 DRAM modules operate at a nominal voltage of 1.5V or 1.35V, offering exceptional clock speeds to cater to the demands of the embedded industry. The modules are available in multiple form factors and technologies, such as ECC and wide-temperature support. All components are of the highest quality, having been sourced directly from the world's first-tier supplier of DRAM chips and stringently tested for unparalleled compatibility, reliability, and performance.

  • JEDEC standard 1.5V ± 0.075V power supply

  • Low Voltage models: JEDEC standard 1.35V (1.28V~1.45V) power supply

  • 8 bit pre-fetch

  • Burst Length: 4, 8

  • Internal calibration through ZQ pin

  • On-die termination with ODT pin

  • Serial presence detect with EEPROM

  • 100% tested for stability, compatibility and performance

Spezifikationen für TS512MSK64V6H

Features

CAS-Latenz

11

ECC

No

Gepufferter Speichertyp

Unregistered (unbuffered)

Interner Speicher

4 GB

Interner Speichertyp

DDR3

Komponente für

Laptop

Modulkonfiguration

512M x 8

Speicher-Ranking

1

Speicherformfaktor

204-pin SO-DIMM

Speicherlayout (Module x Größe)

1 x 8 GB

Speicherspannung

1.5 V

Speichertaktfrequenz

1600 MHz

Logistics data

Code des Harmonisierten Systems (HS)

84733020

Operational conditions

Betriebstemperatur (TT)

0 - 85 °C

Other features

Code des Harmonisierten Systems (HS)

84733020

Package dimensions

Gross Weight

0.2 kg

Product dimensions

Net Weight

0.1 kg

Vendor information

Brand Name

Warranty

1 Jahre)

Beschreibung

Transcend DDR3, 1600 MHz, 2GB, SO-DIMM, 1Rx8, (512Mx8)x8, 1.5V

Transcend's DDR3 DRAM modules operate at a nominal voltage of 1.5V or 1.35V, offering exceptional clock speeds to cater to the demands of the embedded industry. The modules are available in multiple form factors and technologies, such as ECC and wide-temperature support. All components are of the highest quality, having been sourced directly from the world's first-tier supplier of DRAM chips and stringently tested for unparalleled compatibility, reliability, and performance.

*Die oben genannten Produktdaten werden von Icecat zur Verfügung gestellt. EET ist nicht verantwortlich für eventuelle Fehler in diesem Zusammenhang.