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- Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g – XZ019
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
MPN XZ019
Artikel-Nr. W128598375
Lagerbestand
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
Spezifikationen für XZ019
Features
Betriebstemperatur (TT)
-30 - 280 °C
Hinweis zur Viskosität
73 CPS
Produktfarbe
Black/Red/White
Thermischer Widerstand
0,201 °C/W
Wärmeleitfähigkeit
5,15 W/m·K
Zertifizierung
CE
Package dimensions
Depth (package,cm)
2 cm
Gross Weight
0,01 kg
Height (package,cm)
1 cm
Width (package,cm)
12 cm
Packaging data
Menge pro Packung
1 Stück(e)
Product dimensions
Net Weight
0,01 kg
Technical details
Nachhaltigkeitszertifikate
RoHS
Vendor information
Brand Name
Warranty
1 Jahre)
Beschreibung
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
*Die oben genannten Produktdaten werden von Icecat zur Verfügung gestellt. EET ist nicht verantwortlich für eventuelle Fehler in diesem Zusammenhang.