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- HP BLC7000 CTO Generation 2 – 507019-B21-RFB
HP BLC7000 CTO Generation 2
HP BLC7000 CTO Generation 2
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MPN 507019-B21-RFB
EAN / UPC 5712505897843
Lagerbestand
The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.
The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is deli...
Spezifikationen für 507019-B21-RFB
Package dimensions
Gross Weight
7 kg
Product dimensions
Net Weight
6,9 kg
Vendor information
Brand Name
Homepage
http://h18000.www1.hp.com/products/quickspecs/division/division.html#12922
Warranty
1 Jahre)
Beschreibung
The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years.
The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is delivered through a pooled-power backplane, and power input flexibility is provided with choices of single-phase, 3-Phase AC input, and -48V DC input.
*Die oben genannten Produktdaten werden von Icecat zur Verfügung gestellt. EET ist nicht verantwortlich für eventuelle Fehler in diesem Zusammenhang.